AUSTIN, TX – Feb 21, 2024 – SandBox Semiconductor, a pioneer in applying physics-based, AI-enabled modeling to accelerate the development of semiconductor manufacturing processes, will participate in the SPIE Advanced Lithography + Patterning Conference taking place February 25-29, 2024 in San Jose. Dr. Meghali Chopra, CEO and Co-founder of SandBox Semiconductor will deliver a keynote titled: Leveraging AI in Semiconductor Process Development and Dr. Mokbel Karam will present a poster titled: Virtual Metrology for 3D Architectures using Machine Learning. In addition, the company’s Weave™ image processing and analysis tool will be featured in a presentation from imec titled: “Dry Etch Challenges For Pattern Middle-Of-Line (MOL) Contact Trench In Monolithic CFET (complementary FET). Weave™ enables process engineers to rapidly extract key critical dimension information from microscopy images.
“Semiconductor manufacturing has a lot to gain from AI for those who embrace it, especially in the area of process engineering,” said Dr. Chopra. “Determining the best process conditions is so challenging that oftentimes a recipe will take two years or longer to develop, or worse, the chip is dropped from production because the cost of the process development became too expensive. Furthermore, semi-equipment manufacturers risk losing hundreds of millions in tool sales if their process development efforts fall behind those of their competitors. We’re looking forward to discussing how physics-based modeling coupled with AI can allow engineers to streamline process development, shrink timelines and decrease dependency on extensive physical experiments.”
SandBox Semiconductor at SPIE
The SPIE Advanced Lithography and Patterning Conference being held at the San Jose McEnery Convention Center, 150 W San Carlos Street, San Jose, California 95113 will include two presentations from SandBox Semiconductor:
Keynote presentation: Leveraging AI in Semiconductor Process Development
· Dr. Meghali Chopra, CEO and Co-founder of SandBox Semiconductor
· 26 February 2024 • 5:20 PM - 6:00 PM PST | Convention Center, Room 210A
Conference presentation AI Track: Virtual metrology for 3D architectures using machine learning
· Dr. Mokbel Karam, AI Applications Engineer, SandBox Semiconductor
· 28 February 2024 • 5:30 PM - 7:00 PM PST | Convention Center, Hall 2
There are thousands of steps involved in semiconductor process development which represent a tremendous opportunity for AI-based approaches that excel in automating routine tasks and recognizing patterns in data. SandBox Studio™ AI combines physics-based modeling with AI to allow engineers to optimize unit processes in etch and deposition, meeting diverse engineering needs and ensuring data security. To learn more or meet with the Sandbox team at SPIE please reach out on our website.
Founded in 2016, SandBox Semiconductor is a pioneer in developing AI-based software solutions to accelerate process development for semiconductor manufacturing. Its fully integrated AI tool suite gives process engineers the ability to build their own physics-based, AI-enabled models to solve challenges during process definition, ramp-up, and high-volume manufacturing.
